ZL88801LDG1是美国微芯公司MICROCHIP推出的一款电信接口芯片，产品采用VQFN64封装，托盘包装1300pcs一包装。

品牌

品牌：Microchip Technology

Datasheet

Datasheet

参数
产品编号：ZL88801LDG1
封装：64-VFQFN 裸露焊盘 (64-QFN（9x9）)
功能：电信电路
接口：PCM
电压 - 供电：3.135V ~ 3.465V
工作温度：-40°C ~ 85°C
安装类型：表面贴装型

功能
功能描述：IC TELECOM INTERFACE 64QFN，即64引脚的电信接口集成电路。
价格
价格：价格会根据购买数量有所变化，以下是一些参考价格：


应用
应用：虽然搜索结果中没有明确列出ZL88801LDG1的具体应用领域，但根据其电信电路的功能，可以推测它可能用于电信基础设施、数据通信、网络设备等。
其他信息

具体技术规格和详细应用场景可能需要参考ZL88801LDG1的官方数据手册或直接咨询供应商。价格信息可能会随市场变化而变动，建议在购买前确认最新价格。

Part Number
ZL88801LDG1-ND
Manufacturer
Microchip Technology
Manufacturer Product Number
ZL88801LDG1
Description
IC TELECOM INTERFACE 64QFN
Manufacturer Standard Lead Time
5 Weeks
Customer Reference
Detailed Description
Telecom IC Telecom Circuit 64-QFN (9x9)
Datasheet
 Datasheet
Product Attributes
TYPE
DESCRIPTION
SELECT ALL
Category
Integrated Circuits (ICs)
Interface
Telecom
Manufacturer
Microchip Technology
Series
-
Packaging
Tray
Part Status
Active
Function
Telecom Circuit
Interface
PCM
Number of Circuits
1
Voltage - Supply
3.135V ~ 3.465V
Current - Supply
-
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
64-VFQFN Exposed Pad
Supplier Device Package
64-QFN (9x9)
Base Product Number
ZL88801
Documents & Media
RESOURCE TYPE LINK
Datasheets ZL88801
Environmental Information
Microchip RoHS
Microchip REACH
Microchip CA Prop65
PCN Design/Specification Marking Change 05/Apr/2019
PCN Assembly/Origin Assembly 12/Jun/2020
PCN Packaging Packing Changes 07/Jul/2019
PCN Part Number Part Number Change 05/Apr/2019
PCN Other Mult Devices 06/May/2019
HTML Datasheet ZL88801
Simulation Models ZL88801LDF1.ibis
Environmental & Export Classifications
ATTRIBUTE DESCRIPTION
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

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